IAI Istituto Affari Internazionali
Published on IAI Istituto Affari Internazionali (https://www.iai.it)

Home > Chips: EU’s Ambition in a Transatlantic Technology Bridge

Chips: EU’s Ambition in a Transatlantic Technology Bridge [1]

IAI Papers [2]

Chips: EU’s Ambition in a Transatlantic Technology Bridge

[3]
Authors:
Nicola Bilotta [4]
28/02/2024

Semiconductors are vital building blocks of digital technologies. In line with its aspiration for strategic autonomy, the EU has recognised vulnerabilities in its chip supply chain, which heavily relies on foreign firms. The intricate relationship between economic security and open trade underlies the EU’s quest to bolster its domestic capacity while enhancing connections with key global partners. Despite the challenges of finding a policy balance, fostering transatlantic cooperation in the semiconductor domains remains a key ambition. To cultivate a more balanced and effective partnership with the US, the EU should capitalise on its comparative advantages to amplify and fortify its strategic positioning in the global supply chain.

This paper is part of the project “Building a transatlantic technology bridge: challenges and opportunities”, funded by Fondazione Compagnia di San Paolo.

iaip2406.pdf [3]

Details

  • Details

    Rome, IAI, February 2024, 15 p.
  • In:
    IAI Papers [2]
  • Issue

    24|06
  • ISBN/ISSN/DOI:
    978-88-9368-320-3

Table of contents

Introduction
1. EU weakness in the semiconductor value chain
2. The European Chips Act
3. Neither one can make it alone
4. From concept to application for a balanced EU-US cooperation
References


Source URL:https://www.iai.it/en/pubblicazioni/c03/chips-eus-ambition-transatlantic-technology-bridge

Links
[1] https://www.iai.it/en/pubblicazioni/c03/chips-eus-ambition-transatlantic-technology-bridge [2] https://www.iai.it/en/pubblicazioni/lista/all/iai-papers [3] https://www.iai.it/sites/default/files/iaip2406.pdf [4] https://www.iai.it/en/persone/nicola-bilotta